Application specific tape automated bonding
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 3, 1995
Issued Date -
N/A
app pub date -
Mar 18, 1993
filing date -
Oct 13, 1989
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method for patterning a tape to which an integrated circuit may be bonded including providing a tape having a top layer of unexposed film which, when exposed in an interconnection pattern and developed, acts as a mask for processing a photoprocessable layer of the tape to provide conductive portions in an interconnection pattern on the tape.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully