Directly bondable termination for a fixed discrete wire
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Jan 3, 1995
Grant Date -
N/A
app pub date -
Jan 15, 1993
filing date -
Jan 15, 1993
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An apparatus and method for wire termination in wire scribed circuit boards is provided. The system includes a plurality of wires having termination areas, scribed on an insulating substrate. The top portion of the termination areas is then removed by a router to expose the wire with a flat surface. The exposed portion of the wire is then covered by a metal suitable for electrical connection bonding.
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