Encapsulated electronic component having a heat diffusing layer
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United States of America Patent
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Jan 3, 1995
Grant Date -
N/A
app pub date -
Jul 6, 1993
filing date -
Jul 6, 1993
priority date (Note) -
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Abstract
An encapsulated electronic component having an integral heat diffuser. The heat producing electronic component (10) is mounted on a substrate carrier (12) and a layer of encapsulant material (16) covers the component. A layer of thermally conductive material (18) is applied over the encapsulant material, and then a second layer of encapsulant material (20) is applied over the thermally conductive material. The heat generated by the component is distributed throughout the thermally conductive material, thereby eliminating the hot spot over the component, resulting in a substantially lower surface temperature.
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