Binder system for use in the injection molding of sinterable powders and molding compound containing the binder system
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United States of America Patent
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Jan 10, 1995
Grant Date -
N/A
app pub date -
Mar 16, 1993
filing date -
Mar 16, 1992
priority date (Note) -
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Importance
Abstract
The improved binder system for use in the injection molding of sinterable powders such as metal powders, ceramic powders and cermet powders comprises a (co)polymer that has a molecular weight in excess of 2000 and which contains at least one epoxy group in the molecule. Preferably, the binder system comprises said (co)polymer, a (co)polymer other than said (co)polymer, and an organic compound having a molecular weight up to 2000. Using a binder system comprising (a) 3-80 wt % of a (co)polymer that has a molecular weight in excess of 2000 and which has at least one epoxy group in the molecule, (b) up to 70 wt % of a (co)polymer other than component (a), and (c) 20-80 wt % of an organic compound having a molecular weight of not more than 2000, there is provided a composition for the injection molding of sinterable powders. The compound has excellent moldability and strength properties. The powders to be mixed with the binder system for use in injection molding have preferably average particle sizes in the range of 0.01-1000 .mu.m.
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