Hermetic semiconductor device having jumper leads
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United States of America Patent
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-
Jan 10, 1995
Issued Date -
N/A
app pub date -
May 6, 1994
filing date -
Feb 1, 1993
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A fine-pitch hermetic device (10) can be manufactured wherein two sets of wire bonds (18 & 20) are used to electrically connect a semiconductor die (12) to a leadframe (16). Jumper leads or conductive pads (28) are placed on an inner surface of a ceramic base (14) to electrically interconnect the two sets of wire bonds. The jumper leads enables shorter wire lengths to be used. The leadframe is attached to the ceramic base with glass embed technology. A cap (22) is affixed to the base with a hermetic seal (24). The invention is also compatible with flip-chip dice and multichip modules.
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