Method of stripping resists from substrates using hydroxylamine and alkanolamine
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United States of America Patent
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Jan 17, 1995
Issued Date -
N/A
app pub date -
Oct 28, 1993
filing date -
Nov 5, 1990
priority date (Note) -
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Abstract
A stripping composition for removing resists from substrates containing hydroxylamine and at least one alkanolamine is described. Optionally, one or more polar solvents can also be included in the stripping composition. The stripping composition is especially suitable for removing a photoresist from a substrate during the manufacture of semiconductor integrated circuits and for removing cured polymer coatings, such as polyimide coatings.
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