Casting of raised bump contacts on a substrate
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United States of America Patent
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Jan 17, 1995
Issued Date -
N/A
app pub date -
Sep 15, 1993
filing date -
Sep 15, 1993
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A technique for simultaneously forming large numbers of solder ball (or bump) contacts on a surface of a substrate is described. A mold is provided for receiving a substrate. Recesses in the mold are shaped to form contacts of a desired size, and are arranged to align with contact pads on the surface of the substrate. When the substrate is inserted into the mold and the mold is closed, the contact pads align with the recesses. Molten solder is introduced into the recesses and, upon cooling, forms conductive raised bump contacts on the contact pads. The substrate is then removed from the mold. Various features of the invention are directed to forming 'tall' contacts with an aspect ratio (height to width ratio) of greater than 1:1, processing more than one substrate at a time, processing substrates of different sizes, and processing substrates with different contact patterns.
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