Soldering flux
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United States of America Patent
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Jan 17, 1995
Grant Date -
N/A
app pub date -
Jan 28, 1994
filing date -
Feb 1, 1993
priority date (Note) -
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Abstract
A soldering flux composition includes an aqueous solution containing as component (A) a compound selected from (i) hydrohalides and hydrophosphates of guanidine and substituted guanidines, (ii) hydrohalides and hydrophosphates of a five-membered nitrogen containing heterocyclic amine of the formula C.sub.x N.sub.y H.sub.3 in which x is 1 or 2 and y is 4 or 5, and mixtures of (i) and (ii) and as component (B) at least one compound selected from hydrohalides and hydrophosphates of aliphatic amines selected from aliphatic monoamines of formula CH.sub.3 (CH.sub.2).sub.n NR.sub.2 and aliphatic diamines of formula R.sub.2 N(CH.sub.2).sub.m NR.sub.2 in which n is 0 to 10, m is 5 to 10 and R is hydrogen, methyl, ethyl, propyl or butyl, the components (A) and (B) being present in the relative proportions of 25 to 100% by weight of (A) and 75 to 0% of (B).
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