Curing agent for aqueous epoxy resin dispersions, process for its preparation and its use
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United States of America Patent
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Jan 17, 1995
Grant Date -
N/A
app pub date -
Apr 28, 1993
filing date -
Apr 28, 1992
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Abstract
A curing agent for aqueous epoxy resin emulsions is described, which curing agent contains 10-80% by weight of at least one emulsifier, 1-80% by weight of at least one coemulsifier, and 5-80% by weight of at least one bis(diamine)-diepoxide adduct. Optionally, the curing agent furthermore contains 0-80% by weight of a diamine or a mixture of two or more diamines. Said curing agent has the ability of forming microemulsions when water is added, preferably non-ionic oil-in-water microemulsions. Said microemulsions have a good shelf life. They are useful as curing agent for any desired aqueous epoxy resin dispersions, and they can also be used as curing agent in compositions based on epoxy resin and cement mortar.
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