Multilayer printed wiring board and process for manufacturing the same
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United States of America Patent
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Jan 17, 1995
Grant Date -
N/A
app pub date -
Oct 17, 1991
filing date -
Oct 17, 1990
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The multilayer printed wiring board of this invention consists of a base substrate, a plurality of multilayer interconnections formed by lamination of metal wiring layer and insulation layer on the base substrate and ceramic substrates provided with through holes for electrical connection of the multilayer interconnections and inserted between two multilayer interconnections. The manufacturing method comprises lamination of metal wiring layers and insulation layers on both sides of ceramic substrates to form multilayer interconnections, forming of a multilayer interconnection on the base substrate by laminating a wiring layer and an insulation layer, and integration of the ceramic substrates with metal wiring layers and the base substrate placed together under heated and pressurized conditions.
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