Method of making three dimensional integrated circuit interconnect module
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United States of America Patent
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Jan 24, 1995
Issued Date -
N/A
app pub date -
Sep 2, 1993
filing date -
Sep 3, 1991
priority date (Note) -
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Abstract
A three dimensional integrated circuit interconnect for connecting a plurality of chips in a module with a standard footprint for pin grid array or quad flat pack mounting. Each IC is mounted on a custom interconnect slice and tested. The slices are stacked together with electrical connections from one slice layer to the next. The module may use multi-layer ceramic slices or printed circuit board materials.
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