Low particle wafer automatic flat aligner
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United States of America Patent
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-
Jan 24, 1995
Grant Date -
N/A
app pub date -
Aug 20, 1993
filing date -
Aug 20, 1993
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Disclosed is an apparatus and method for aligning the flat edges of semiconductor wafers in a wafer cassette. The apparatus includes a roller and alignment blade mounted in a frame on which the wafer cassette is mounted. A motor mechanism rotates the roller and alignment blade to align the wafer flat edges.
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