Two-layered tape lead wire for magnetic head

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United States of America Patent

PATENT NO 5384432
SERIAL NO

08068141

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Abstract

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A tape lead wire includes a polymer resin film and conductor films. The conductor films are directly deposited on the surface of the polymer resin film without using any bonding layer. The total thickness of the tape lead wire can be made smaller than that of a conventional lead wire. The tape lead wire has a high flexibility, can be easily bent, can extremely reduce the bending spring rigidity and is suitable for a magnetic head having a reduced size and load, which is imposed by a head supporting device on the magnetic head, and lowered flying height and peripheral speed.

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Patent Owner(s)

Patent OwnerAddress
TDK CORPORATION2-5-1 NIHONBASHI CHUO-KU TOKYO 103-6128

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ishizuka, Masaharu Tokyo, JP 5 48
Itoh, Masahiko Sagamihara, JP 43 546
Kanai, Hiroshi Tokyo, JP 124 1491
Noro, Tetsuya Tokyo, JP 5 72
Ohyama, Nobuya Tokyo, JP 2 30

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