Self-locking heat sinks for surface mount devices
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United States of America Patent
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Jan 31, 1995
Issued Date -
N/A
app pub date -
Jul 27, 1994
filing date -
Feb 28, 1992
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A device for attaching a heat sink to an electronic package comprises a pin having a compressible point, the point being adapted to pass through aligned holes in a heat sink and a printed circuit board so that the point compresses as it passes into two holes and flexes back to an expanded position after it exits the printed circuit board hole opposite the heat sink thereby holding the heat sink to the board with the electronic package therebetween.
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