Method for replacing IC chip package interposer
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 31, 1995
Issued Date -
N/A
app pub date -
Jan 5, 1994
filing date -
Sep 29, 1992
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method of replacing IC chip package wiring having an interposer comprising removing an interposer having a plurality of adhesively laminated interposer layers from the package, delaminating and replacing at least one interposer layer with a corrected interposer layer, relaminating the interposer layers with adhesive thus producing a replacement interposer and remounting the replacement interposer to the IC chip package.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully