Organosilane adhesion promotion in manufacture of additive printed wiring board
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United States of America Patent
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Jan 31, 1995
Grant Date -
N/A
app pub date -
Feb 3, 1993
filing date -
Feb 3, 1993
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The metal (for example, copper) to base material adhesion in an additive printed wiring board is improved by contacting the base material with a solution containing a ureidosilane, preferably also comprising a disilyl crosslinking agent, followed by drying the solution to remove solvent, before contacting the base material with an activating agent for an electroless deposition step. Heating of the board, after the deposition of the metal, for example by baking in an oven or in an autoclave, gives the highest level of adhesion between metal and base material.
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