Method of manufacturing polysilicon film including recrystallization of an amorphous film

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United States of America Patent

PATENT NO 5385863
SERIAL NO

07901071

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Abstract

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A method of fabricating a polysilicon film whose crystal grain size can be controlled in a wide range and which has a large surface area and an application thereof to a DRAM are disclosed. In polycrystallizing an amorphous silicon film having a substantially clean surface, nucleation and crystal growth are performed under different conditions. With this method, crystal grain density and crystal grain size can be controlled easily, causing a polysilicon film having finer grains to be formed concomitant with reduction of capacitor area due to increase of integration density of DRAM.

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Patent Owner(s)

Patent OwnerAddress
NEC CORPORATION A CORP OF JAPAN7-1 SHIBA 5-CHOME MINATO-KU TOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Sakai, Akira Tokyo, JP 333 2851
Tatsumi, Toru Tokyo, JP 49 1572

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