Semiconductor chip bonded to a substrate and method of making
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 31, 1995
Grant Date -
N/A
app pub date -
Jul 22, 1993
filing date -
Jul 22, 1993
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A semiconductor chip is flip chip bonded to a substrate having a cavity or a through hole formed therein. The cavity or through hole is preferably large enough to substantially remove the narrow gap which is formed between the portion of the substrate which does not have the cavity or through hole formed therein. This allows for use of mold processes to encapsulate and underfill the semiconductor chip and for line of sight cleaning of the semiconductor chip after bonding.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully