Flexible substrate folded in a U-shape with a rigidizer plate located in the notch of the U-shape
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United States of America Patent
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Jan 31, 1995
Grant Date -
N/A
app pub date -
Nov 1, 1993
filing date -
Nov 1, 1993
priority date (Note) -
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status (Latency Note)
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Abstract
Semiconductor carrier assemblies (10, 40) use a flexible substrate (11) to connect to at least one semiconductor device (19). Preferably the flexible substrate (11) also connects to a circuit component, preferably a circuit board (31). The flexible substrate (11) is configured in a U-shaped configuration having at least one rigidizer plate (25; 41, 42) positioned in the notch of the U. Interconnections between the semiconductor device (19) and the flexible substrate (11), and, preferably, the circuit component (31) are provided by solder connections (22, 28). Preferably, two rigidizer plates (41,42) having different temperature coefficients of expansion are positioned in the notch of the U of the flexible substrate (11) and preferably a low modulus adhesive layer (50, 51, 47) is utilized in the assembly to minimize thermal stress.
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