Method for manufacturing a circuit board with a plurality of conductive terminal pins

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United States of America Patent

PATENT NO 5386626
SERIAL NO

08118715

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method for manufacturing a circuit board with a plurality of conductive terminal pins includes the steps of: providing a bed with an array of receiving holes formed therein; providing the bed on a vibrating apparatus; placing a plurality of conductive terminal pins on the bed, each of the terminal pins having a shank and an enlarged head; operating the vibrating apparatus to permit insertion of the shank of each of the terminal pins into a respective one of the receiving holes, the enlarged heads of the terminal pins being sized to prevent extension thereof in the respective one of the receiving holes; providing a fiber glass reinforcing plate formed with an array of through-holes; providing a fiber glass circuit board body having a bottom side formed with an array of connectors; superimposing the reinforcing plate and the circuit board body on the bed such that each of the connectors of the circuit board body and the heads of the terminal pins extend in a corresponding one of the through-holes and abut against each other; and heating the bed, the reinforcing plate and the circuit board body under pressure so as to provide a firm bond between the reinforcing plate and the circuit board body and between each of the connectors and the head of a corresponding one of the terminal pins.

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Patent Owner(s)

  • CEN TRONIC CO., LTD.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cheng, Hing-Liang Taipei, TW 1 14

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