Fabrication of a dissolvable film carrier containing conductive bump contacts for placement on a semiconductor device package
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United States of America Patent
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Feb 14, 1995
Issued Date -
N/A
app pub date -
Sep 15, 1993
filing date -
Sep 15, 1993
priority date (Note) -
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Abstract
A technique for simultaneously forming large numbers of solder ball (or bump) contacts on a surface of a substrate is described. A dissolvable film carrier is provided with holes arranged in a shape to correspond to an array of contact pads on a substrate. The holes are filled with solder. The film carrier retains the solder. The carrier is placed over the surface of the substrate and is heated, causing the solder to re-flow and to wet and to adhere to the contact pads. The carrier, which resists the re-flow temperature, maintains the shape of the solder contacts while cooling. After cooling, the film carrier can be removed from around the solder contacts with a suitable solvent.
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