Importance

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Abstract

A test module tests integrated circuit (IC) packages mounted on a loaded printed circuit board (PCB) by first placing the module over the package. Each module has rows of test probes for electrically contacting corresponding electrical leads on the IC package. Solid test probes are mounted in a housing in the test module so that electrical connection is achieved between the probes and a flexible printed circuit board that communicates electrical test signals from an external circuit test analyzer to the probes. A thin, flexible elastic diaphragm is mounted across the ends of the test probes so that the diaphragm is elastically movable away from the housing in response to axial pressure from the test probes being pressed against the leads of the IC package. The diaphragm stretches and thereby provides a spring force against the test probes. The test module is used in test fixtures by mounting the test modules in a probe plate spaced from IC packages to be tested. Other test probes, such as spring probes, are mounted in the probe plate in a pattern corresponding to other test points on the board under test. Another embodiment provides a connector interface in which a flexible diaphragm on the interface provides spring biased pressure for test pins covered in the module and which are electrically connected to terminals on the module. The pins and the terminals provide interface connections between a pair of separate current devices.

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First Claim