Electrical interconnection assembly manufacturing apparatus
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United States of America Patent
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Feb 21, 1995
Grant Date -
N/A
app pub date -
Aug 25, 1993
filing date -
Aug 26, 1992
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An apparatus for manufacturing electrical interconnection assembly in which a wire is laid on wire laying pins on a pin board or an insulating support body at high velocity and with high density. The electrical interconnection assembly manufacturing apparatus according to the present invention comprises: a pinboard; a plurality of wire laying pins standing on the pinboard; a slide plate opposing tips of the wire laying pins; and a nozzle attached to the slide plate, wherein the pinboard and the slide plate relatively move under the condition that the pinboard opposes the slide plate while a wire fed from the nozzle is laid on the plurality of wire laying pins.
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