Semiconductor inner lead bonding tool
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United States of America Patent
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Feb 21, 1995
Grant Date -
N/A
app pub date -
Jul 23, 1993
filing date -
Jul 23, 1993
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A bonding tool for bonding inner leads to semiconductor chips is arranged to capture and align elongated lead sections extending in any one of plural directions, and preferably, in any one of two mutually orthogonal directions. Thus, the tool can be applied to align and bond all of the leads to a chip without turning the tool or the chip even where the leads extend in multiple directions.
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