Compositions and methods for polishing
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United States of America Patent
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Feb 21, 1995
Grant Date -
N/A
app pub date -
May 26, 1993
filing date -
May 26, 1993
priority date (Note) -
In Force
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Abstract
Improved compositions for polishing silicon, silica or silicon-containing articles is provided which consists of an aqueous medium, abrasive particles and an anion which controls the rate of removal of silica. The anion is derived from a class of compounds which contain at least two acid groups and where the pKa of the first dissociable acid is not substantially larger than the pH of the polishing composition. Methods using the composition to polish or planarize the surfaces of work pieces, as well as products produced by such methods, are also provided.
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