Leadframe adapted to support semiconductor elements
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United States of America Patent
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Feb 21, 1995
Issued Date -
N/A
app pub date -
Feb 4, 1994
filing date -
Sep 27, 1990
priority date (Note) -
In Force
status (Latency Note)
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Abstract
In a leadframe for supporting semiconductor devices and including a plurality of outer lead sections, a recess or recesses are provided on each of the outer lead sections at a central portion or both sides of each outer lead section in a region including a cutting line. The recess or recesses reduce the cross-sectional area of the lead section, thus enabling a new cut surface of the lead section to be well covered by solder and enabling ready cutting of the lead section.
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