Diamond multilayer multichip module substrate
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United States of America Patent
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-
Feb 21, 1995
Grant Date -
N/A
app pub date -
Mar 16, 1994
filing date -
Mar 16, 1994
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Diamond is used as a dielectric layer to separate the metalization layers multichip module substrates. The diamond has use for both electrical and thermal conduction. Such multichip module substrates may have a diamond base, or a base constructed from silicon, aluminum nitride, molybdenum, or any other material supportive of the nucleation and growth of diamond films. The metalization may be molybdenum or other conductor supportive of the nucleation and growth of diamond films. Using diamond as an interlayer dielectric in a multichip system permits a significant increase in the amount of power that can be dissipated by the system. The diamond does not obstruct the system's metalization, so that routing density can be increased and interconnection length may be decreased, enhancing host chip operation.
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