Semiconductor assembly having laminated semiconductor devices
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United States of America Patent
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-
Feb 28, 1995
Grant Date -
N/A
app pub date -
Mar 12, 1992
filing date -
Mar 13, 1991
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A semiconductor assembly comprises first and second containers which contain respective semiconductor chips and are stacked one over another. First and second external leads extending from the insides of the respective containers to outside thereof are bent so as to be connected to each other. The first and the second containers may be provided at corresponding positions with a recess and a projection to be engaged each other for positional alignment. There may be provided first and second heat radiating plates extending from the insides of the respective containers to outside thereof are bent so as to be connected to each other.
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