Package structure for semiconductor devices and method of manufacturing the same
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United States of America Patent
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Feb 28, 1995
Grant Date -
N/A
app pub date -
Jul 6, 1993
filing date -
Jun 20, 1991
priority date (Note) -
In Force
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Abstract
A package structure in which conductive layers are provided on the lower surface of a circuit substrate provided with a semiconductor element mounted on the upper surface thereof, which conductive layers are connected to a conductive seal portion via conductive through holes, whereby both satisfactory air-tightness and satisfactory electromagnetic shielding characteristics of the package structure can be obtained. Projections consisting of high-temperature solder are formed as externally connecting electrodes, whereby a surface packaging operation can be carried out smoothly.
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