Thin multilayered IC memory card
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United States of America Patent
Stats
-
Feb 28, 1995
Grant Date -
N/A
app pub date -
Jan 11, 1993
filing date -
Sep 4, 1992
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
In an IC memory card, sub-modules, in each of which a plurality of memory ICs are mounted on each of two opposed surfaces of a sub-substrate, are mounted on each of two opposed surfaces of a single substrate. Since the number of substrates connected to a connector is one, soldering of the connector is facilitated, and the structure of the connector can be simplified. Furthermore, in an IC memory card, the sub-modules may be mounted on the substrate in such a manner that they are stacked in two stages at an opening in the substrate. In this way, the thickness of the IC memory card can be minimized. Also, the use of the die bonding process makes connection between the sub-module and the substrate easy.
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