Ultra-thick thick films for thermal management and current carrying capabilities in hybrid circuits
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United States of America Patent
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Mar 7, 1995
Grant Date -
N/A
app pub date -
Mar 29, 1993
filing date -
Mar 29, 1993
priority date (Note) -
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Abstract
Disclosed is an ultra-thick thick film of copper or silver or other suitable conductor material for use in spreading heat laterally, i.e., in the x and y directions, along a substrate. A substrate of suitable thickness is chosen to dissipate heat in the vertical or z-direction underneath a heat generating component such as a semiconductor chip. The ultra-thick films have a thickness ranging from about 2 to about 5 mils and are prepared from metal powders having average particles sizes ranging from about 1 micron to 3 microns.
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