Single chip IC tester architecture

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 5396170
SERIAL NO

08034156

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Abstract

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An integrated circuit (IC) test architecture and technique which can be used in conformity with the IEEE 1149.1 test standard and configured on a single chip. This chip can be remotely controlled via a PC or workstation to generate stimulus and collect response data to fully test an IC which matches the foot print of the test chip. The specified technique uses the IEEE test standard with additional logic on a single chip which permits at speed test functional test of ICs. The test chip can be connected to a PC or workstation via the four (4) channel Test Access Port. By remotely controlling the test chip from the PC or Workstation, stimulus and response data can be generated to completely test any Integrated circuit having a foot print matching the IC of the test chip. In one embodiment, the test chip is mounted on a probe card for at speed functional test of wafers. In another embodiment, the test chip is placed in a socket or adapter for at speed package level test. In another embodiment, the test chip is sandwiched between a device under test (DUT) and the PCB on which the DUT is mounted for at speed board test.

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Patent Owner(s)

Patent OwnerAddress
CADENCE DESIGN SYSTEMS INC2655 SEELY AVENUE SAN JOSE CA 95134

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Alexander, Ruth 17999 Saratoga-Los Gatos Rd., Monte Sereno, CA 95030 2 109
D'Souza, Daniel 17999 Saratoga-Los Gatos Rd., Monte Sereno, CA 95030 9 125

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