Non-destructive interconnect system for semiconductor devices
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United States of America Patent
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Mar 14, 1995
Grant Date -
N/A
app pub date -
Oct 29, 1993
filing date -
Oct 29, 1993
priority date (Note) -
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status (Latency Note)
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Abstract
An interconnect system (8') for providing electrical connection to bond pads on a semiconductor device (21) includes a socket (12) having a plurality of conductors (46) and a carrier assembly (40) mounted on the socket (12) for carrying a semiconductor device (21). The carrier assembly (40) includes a substrate (17) having a compliant membrane (20b) and a plurality of contact bumps (24) on a top surface of the compliant membrane (20b) for contacting bond pads on the semiconductor device (21) and a force applying mechanism (63). Compliant membrane (20b) is part of a thin film interconnect (20). Contact bumps (24) are connected electrically with conductors (46) by conductive traces (19) and contact pads (18) formed on the thin film interconnect (20). The force applying mechanism (63') applies pressure in making temporary electrical connection between contact bumps (24) and the bond pads of semiconductor device (21). The interconnection system ( 8') provides non-destructive interconnection to semiconductor device (21).
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