Semiconductor device including stacked die

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United States of America Patent

PATENT NO 5397916
SERIAL NO

08095524

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Abstract

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Leadframes from a TAB tape having die attached are curved and the free ends of the leads curve back over themselves. A separator, attached to the die, defines a pocket for receiving the free end of the leads. The die and separator form a subassembly which is combined with other subassemblies to make the stack. Sides having an array of conductive contact areas connected in a predetermined pattern are placed against the edges of the die to touch the curved leads which form a resilient contact with the sides. A resilient member is located within the curved leads to support the leads during assembly. In one embodiment, the leads are wrapped around the edges of the die itself. In other embodiments, the leads are wrapped around the edge of the separator. A first construction of the stack facilitates assembly of the stack from the bottom up and a second construction facilitates assembly of the stack from the top down.

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Patent Owner(s)

Patent OwnerAddress
NORMINGTON PETER J CNot Provided

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Normington, Peter J C 516 E. Country Plaza South, Gilbert, AZ 85234 2 332

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