Adhesion promoting additives and low temperature curing organosiloxane compositions containing same
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United States of America Patent
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Mar 21, 1995
Grant Date -
N/A
app pub date -
May 10, 1994
filing date -
May 10, 1994
priority date (Note) -
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Abstract
Adhesion additives for curable organosiloxane compositions comprise (I) a silane containing at least one alkoxy or enoloxy group, the remaining valences of the silicon atom being satisfied by groups bonded to silicon through oxygen and containing at least one H.sub.2 C.dbd.CR-- radical, where R is hydrogen or monovalent hydrocarbon, and (II) at least one organosilicon compound comprising (a) at least one group capable of participating in a hydrosilation reaction, and (b) at least one silicon-bonded alkoxy, enoloxy or silanol group.
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