Apparatus for assessing solderability

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United States of America Patent

PATENT NO 5401380
SERIAL NO

08095139

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Apparatus for assessing solderability of electronic component leads and printed wiring boards by sequential electrochemical reduction. The apparatus detects and quantifies the oxides present on copper, solder, andintermetallics that are detrimental to solderability. A solderable portion of the component to be tested is immersed in an electrolyte to form an electrode. An inert counter electrode and a reference electrode are also placed in the electrolyte. A current is passed from the inert counter electrode to the tested component, and the potential between the component and the reference electrode is recorded as a function of time. In a plot of the electrode potential versus the total charge passed, a series of inflection points identify and quantify particular metallic oxides present on the solder. The plot is compared with previous analyses of aged specimens having known oxide compositions that correlate with degradation of solderability. The apparatus is useful for testing off-the-shelf components and for control of circuit board manufacturing and assembly processes.

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Patent Owner(s)

Patent OwnerAddress
TELEDYNE SCIENTIFIC & IMAGING LLC1049 CAMINO DOS RIOS THOUSAND OAKS CA 91360

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Anderson, Dennis P Newbury Park, CA 6 34
Tench, D Morgan Ventura, CA 33 1031

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