Semiconductor device of multichip module-type
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United States of America Patent
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Mar 28, 1995
Issued Date -
N/A
app pub date -
Sep 9, 1993
filing date -
Feb 18, 1991
priority date (Note) -
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Abstract
A semiconductor chip is packaged within film carriers which serve as the enclosure of the semiconductor chip. The finished semiconductor device is flexible, bendable, and very thin. In manufacturing this semiconductor device, the process of laminating film carriers, the process of electrically connecting the semiconductor chip and film carriers, and the process of sealing the semiconductor chip, can be performed at the same time, shortening the manufacturing time and reducing manufacturing cost.
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