Semiconductor device with enhanced adhesion between heat spreader and leads and plastic mold compound
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United States of America Patent
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Mar 28, 1995
Grant Date -
N/A
app pub date -
Nov 10, 1992
filing date -
Nov 10, 1992
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A semiconductor device (10) includes a semiconductor die (18) and a heat spreader (16) adjacent the semiconductor die (18) for carrying heat away from the semiconductor die (18). The heat spreader (16) has a copper core (30) and a cupric oxide coating (32) formed on at least a portion of the core (30). A plastic package (12) is molded onto the semiconductor die (18) and the heat spreader (16) for supporting the semiconductor die (18) and the heat spreader (16). The cupric oxide coating (32) enhances adhesion of the heat spreader (16) to the plastic package (12).
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