Printed circuit board having through-hole stopped with photo-curable solder resist
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United States of America Patent
Stats
-
Mar 28, 1995
Grant Date -
N/A
app pub date -
Feb 3, 1993
filing date -
Feb 10, 1992
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A printed circuit board having a through-hole in a land is disclosed. A solder resist of a photo-curable solder resist is formed on the substrate surface of the printed circuit board and the through-hole is stopped with the same photo-curable solder resist as the solder resist layer. If a land on which a chip component is mounted co-exists with a land on which a discrete component is mounted, only the through-hole in the land on which the chip component is mounted is selectively stopped with the photo-curable solder resist. The solder resist layer and the photo-curable solder resist stopping the through-hole are formed by selective light exposure from both the front and reverse surfaces of the substrate.
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Cited Art Landscape
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