Importance

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Abstract

A technique for mounting polishing pads to a platen in chemi-mechanical polishing apparatus is disclosed. With two polishing pads, prior to assembly, a seal of material impervious to the chemical action of a polishing slurry is disposed about the perimeter of the interface between the pads. Preferably, the seal is a bead of silicon-based 'gasket' material, such as General Electric silicon caulk (RTV) or Dow Corning silicon adhesive, and is disposed in a ring at a radius r' about one inch inward from the perimeter (circumference) of the pads. When the pads are assembled together, the bead squashes and (1) forms a seal, and (2) causes the periphery of the upper pad to curve upward--thereby creating a bowl-like reservoir for increasing the residence time of slurry on the face of the pad prior to overflowing the pad.

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First Claim