Method and apparatus for monitoring layer processing
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United States of America Patent
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Apr 4, 1995
Issued Date -
N/A
app pub date -
Sep 3, 1993
filing date -
Jul 15, 1992
priority date (Note) -
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Abstract
The method and apparatus of the invention permit in situ determinations to be made of the temperature and optical constants of a substrate surface that is being treated, by measurements of radiance, reflectance and transmittance. These determinations in turn provide, at any given instant during processing, compositional and other information, thereby affording highly effective feedback control of the processing conditions. The apparatus comprises an integrated, small and relatively inexpensive instrument for process monitoring.
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