Method for producing a light emitting diode having transparent substrate

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United States of America Patent

PATENT NO 5403916
SERIAL NO

08196013

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Abstract

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A method for producing a light emitting diode includes the steps of: forming a first semiconductor multilayer on a first semiconductor substrate having a first conductivity type; forming a light emitting layer on the first semiconductor multilayer; forming a second semiconductor multilayer; disposing a second substrate which is transparent to light emitted from the light emitting layer on the second semiconductor multilayer; and bonding the second substrate and the second semiconductor multilayer through direct bonding with heating a vicinity of an interface between the second substrate and the second semiconductor multilayer.

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Patent Owner(s)

  • SHARP KABUSHIKI KAISHA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Takiguchi, Haruhisa Nara, JP 59 800
Watanabe, Masanori Nara, JP 185 2883

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