Method of manufacturing multilayer printed wiring board
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Apr 11, 1995
Grant Date -
N/A
app pub date -
Apr 30, 1993
filing date -
May 1, 1992
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method of manufacturing a printed wiring board. A printed wiring board having a substrate and a circuit pattern formed thereon is provided. At least one through-hole is formed in the substrate. A plurality of fine wires are inserted into the through-hole, and a molten solder is filled into the through-hole by a capillary action due to small gaps formed between the fine wires. A multilayer printed wiring board may be provided comprising a plurality of wiring board layers each having a substrate and a respective circuit pattern formed thereon. The molten solder filled in the through-hole electrically connects at lest two of the respective circuit patterns. The plurality of fine wires may be disposed in a conductive hollow tubular body which is inserted along with the fine wires into the through-hole. Also, the plurality of fine wires may be arranged as a mesh sheet that is formed into a tubular body and inserted into the through-hole. If an electronic component is to be connected with the printed wiring board through the through-hole, the leads of the electronic component may comprise the plurality of fine wires.
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Cited Art Landscape
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