Light emitting device resistant to damage by thermal expansion

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United States of America Patent

PATENT NO 5406170
SERIAL NO

08162949

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Abstract

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The present invention relates to light emitting devices which emit light upon impingement of thermoelectrons on a front panel having fluorescent elements and where an array of cathodes and electrodes are provided on a substrate within each light emitting device. Thus, in the present invention, first electrode leads having a coefficient of thermal expansion substantially equal to that of the substrate are inserted into and through the substrate, and second electrode leads having a coefficient of thermal expansion substantially equal to that of the rear panel are inserted into and through the rear panel, and the first and second electrode leads are connected such that the substrate is supported at a distance above the rear panel.

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Patent Owner(s)

Patent OwnerAddress
ISE ELECTRONICS CORPORATIONISE-SHI MIE

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Futatsuishi, Shunichi Nagasaki, JP 11 84
Hara, Zenichiro Nagasaki, JP 32 370
Iwata, Shuji Hyogo, JP 16 281
Kamogawa, Hiroshi Mie, JP 13 215
Kanda, Isamu Mie, JP 8 19
Nishii, Yoshiyuki Mie, JP 4 14
Seko, Yukiharu Mie, JP 5 14
Shibayama, Kozaburo Nagasaki, JP 4 14
Shimojyo, Tokuhide Mie, JP 3 10
Tatsuda, Kazunori Mie, JP 12 46
Terazaki, Nobuo Nagasaki, JP 15 55
Uemura, Sashiro Mie, JP 25 256

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