Thin film capacitor and method of manufacturing the same

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United States of America Patent

PATENT NO 5406445
SERIAL NO

08216966

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Abstract

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A NaCl oxide thin layer oriented to (100) face or a spinel oxide thin layer oriented to (100) face, a perovskite dielectric thin layer oriented to (100) face and a metal electrode are sequentially laminated on a metal electrode, thus providing a thin film capacitor. Or alternatively, a thin film capacitor is manufactured by sequentially laminating a NaCl oxide thin layer oriented to (100) face or a spinel oxide thin layer oriented to (100) face, a platinum thin layer as a lower electrode oriented to (100) face, a perovskite dielectric thin layer oriented to (100) face and a metal thin layer as an upper electrode on a substrate. A plasma-enhanced CVD method is applied to form a NaCl oxide thin layer, a spinel oxide thin layer and a perovskite dielectric thin layer while a vacuum deposition method, a sputtering method, a CVD method or a plasma-enhanced CVD method is applied for the formation of a metal electrode.

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Patent Owner(s)

  • MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fujii, Eiji Kyoto, JP 126 1331
Fujii, Satoru Osaka, JP 81 1956
Hattori, Masumi Osaka, JP 12 107
Takayama, Ryoichi Osaka, JP 57 874
Tomozawa, Atsushi Osaka, JP 32 419
Torii, Hideo Osaka, JP 69 1051

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