Process for forming passivated film
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United States of America Patent
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Apr 18, 1995
Grant Date -
N/A
app pub date -
Jun 23, 1993
filing date -
Feb 18, 1991
priority date (Note) -
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Abstract
A process for a passivated film which is far reduced in the amount of gas discharge and can desorb an adsorbed gas more readily, which process comprises heating a stainless member with a surface roughness, Rmax, of 1.0 .mu.m or less in an atmosphere of a mixture comprising oxygen gas and an inert gas and having a dew point of -95.degree. C. or below, an impurity concentration of 10 ppb or less and an oxygen content 5 ppm 25 vol % at 300.degree. to 420.degree. C.
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