Process for mounting a semiconductor chip and depositing contacts into through holes of a circuit board and of an insulating interposer and onto the chip
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United States of America Patent
Stats
-
Apr 18, 1995
Issued Date -
N/A
app pub date -
Jul 23, 1993
filing date -
Jul 24, 1992
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A process of manufacturing a semiconductor chip that has a connecting pad and is connected to a front side of a circuit board that has a conductive trace connected to a through-hole. An insulating adhesive layer, which has a hole corresponding to the pad, is interposed between the chip and the board so that the pad, the hole in the insulating layer and the through-hole in the board are aligned. A conductive material is applied into the through-hole from the back side of the board so as to fill the through-hole and connect the pad to the trace. The conductive material may be applied using a sputtering method, a screening method, an electroplating method or an evaporating method. The back side of the board is polished to remove conductive material which may have been applied on the back side of the board outside the through-hole.
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