Compositions containing hollow microspheres
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United States of America Patent
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Apr 18, 1995
Issued Date -
N/A
app pub date -
Feb 10, 1994
filing date -
Dec 17, 1991
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A composition is described with comprises a mixture of (A) from about 5% to about 60% by weight of at least one water-insoluble polymer; (B) from about 1% to about 30% by weight of inorganic or synthetic resinous hollow microspheres; and (C) from about 20% to about 70% of at least one volatile organic liquid which is a solvent for the polymer of (A). The compositions also may contain (D) at least one solid particulate inorganic filler. Adhesive compositions such as solvent cements prepared in accordance with the present invention are characterized as low V(olatile) O(rganic) C(hemical) compositions wherein the VOC is, for example, less than 500 or even less than 400 grams per liter.
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