Importance

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Abstract

A high frequency wafer probe for measuring characteristics of a device operating in a high frequency range includes a waveguide serving as a grounding conductor of the probe, an end of which is open, having a tip and extending from an upper wall of the waveguide in the vicinity of the open end which gradually increases in extent as it approaches the open end and the tip; a signal contact part disposed on a tip of the ridge for contacting a signal input terminal of a device under test; and a plurality of grounding contact parts disposed on the same plane as the signal contact part opposite to each other with the signal contact part between two of the signal contact parts for contacting a plurality of grounding terminals of a device under test. In this structure, the contact parts of the probe can be accurately positioned on the terminals of an IC chip under test, and the contact conditions are easily visually confirmed. In addition, a high frequency wafer probe with low loss and low reflection is achieved.

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First Claim