Electronic circuit assembly with optical waveguide for interconnecting electronic components
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United States of America Patent
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-
Apr 18, 1995
Grant Date -
N/A
app pub date -
Dec 1, 1993
filing date -
Dec 3, 1992
priority date (Note) -
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Abstract
A method of forming an electronic circuit assembly in which channels are formed in a surface of a circuit board e.g. by excimer laser drilling, and then filled with an optically transmissive resin material, to form an optical waveguide structure. A number of electronic devices are mounted on the circuit board, at least some of the devices including optical receiver and/or transmitter means for receiving/transmitting optical signals from/to the waveguide. An optical fibre is coupled to the waveguide.
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